Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP Orr use with tools up

Orr use with tools up to 6

40 - 1984 and IEC942 - 1988 Class 2

With cushion grip

115-7353-25

The case is ideal for camera equipment

Chip Quik SAC305 No-Clean T3 Solder Paste Lead-Free 250g Jar vendor_KASP Orr use with tools upOverview Solder Paste in jar 250g (T3) SAC305 no clean 88. 5% metal. Specifications Alloy Sn96. 5 Ag3. 0 Cu0. 5 Flux Type Synthetic No Clean Flux Classification REL0 Metal Content 88. 5% metal by weight Particle Size T3 (25 45 microns) Melting Point 217 220C (423 428F) Size 250g Jar Stencil Life >8 hours @ 20 50% RH 22 28C (72 82F) >4 hours @ 50 70% RH 22 28C (72 82F) Stencil Cleaning Automated stencil cleaning systems for both stencil and misprinted