Asrock B860 Pro-A WiFi ATX motherboard - Intel B860 LGA 1851 Purpose___Home 5 kg Package height 357

5 kg Package height 357 mm Package depth 255 mm Package width 535 mm Logistics data Harmonized System (HS) code 8518400090

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Asrock B860 Pro-A WiFi ATX motherboard - Intel B860 LGA 1851 Purpose___Home 5 kg Package height 357Pro A series is designed for enhanced stability, durability, and efficiency, it offers reliable performance, user friendly features and a streamlined aesthetic, making it ideal for daily computing needs. Hi Density Power Connector CPU overclocking requires higher current. ASRock Hi Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the